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Which of the following refer to material used for filling the void left in the box but they have poor environmental profile?

Which of the following refer to material used for filling the void left in the box but they have poor environmental profile?
A . Polystyrene chips
B . Cages
C . Metal racking
D . Polypropylene straps

Answer: A

Explanation:

Void filling is the general term giving to the challenge of filling the space left in a box after the products have been packed. This means that if there is no void filling material, the product inside can move around and could be damaged.

Materials to fill voids to secure contents

• Polystyrene (PS) is a synthetic aromatic hydrocarbon polymer made from the monomer known as styrene.[5] Polystyrene can be solid or foamed. General-purpose polystyrene is clear, hard, and rather brittle. It is an inexpensive resin per unit weight. It is a rather poor barrier to oxygen and water vapour and has a relatively low melting point.[6] Polystyrene is one of the most widely used plastics, the scale of its production being several million tonnes per year.[7] Polystyrene can be naturally transparent, but can be coloured with colourants. Uses include protective packaging (such as packing peanuts and CD and DVD cases), containers, lids, bottles, trays, tumblers, disposable cutlery [6] and in the making of models. Polystyrene is generally considered to be non-biodegradable.

However, certain organisms are able to degrade it, albeit very slowly.

• Chips made of bio-degradable materials

• Absorbent and fire-resistant material

• Shredded paper, cardboard or wood-Based material

• Paper or cardboard rolls

• Bubble wrap

• Air-filled cushions

• Self expanding foam

Straps are used to group items into unit load. Polypropylene or polyester are the materials most often used. The wider the strap, the stronger it will be. Using more than one strap and straps for length and width will create a strong place for stock.

Reference:

– Polystyrene (Wikipedia)

– CIPS study guide page 65 LO 1, AC 1.3

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